Wafer Cutting Surfactant Market, Global Outlook and Forecast 2023-2030
The global Wafer Cutting Surfactant market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
Wafer cutting surfactant is a concentrated, aqueous-based solution of wetting agents and surfactants that reduces heat build-up and move swarf particles away from the kerf during the saw dicing process.
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