The global Wafer Cutting Surfactant market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.   Wafer cutting surfactant is a concentrated, aqueous-based solution of wetting agents and surfactants that reduces heat build-up and move swarf particles away from the kerf during the saw dicing process. Download FREE...